PThis book is written for students in two- and four-year technology programs at community colleges and universities. Chapters are organized around the broad technologies applicable to semiconductor manufacturing./PPChapters 1 to 8 present fundamental technical information relevant to semiconductor manufacturing. Chapter 9 presents a process model overview with a general flowchart that links the major areas in wafer fabrication. Chapters 10 to 19 cover each of the major processes. Each process chapter concludes with a summary of quality measures and troubleshooting issues to provide the student with practical challenges encountered during wafer fabrication. Chapter 20 provides an overview of the back-end process for IC assembly and packaging./PPAcademic and industry reviewers have applauded this book as the most comprehensive and up-to-date text currently available in the market./PHTMLH2PREFACE/H2PThis text started with a simple premise: as instructors, we need to teach relevant microchip technology to students and employees in semiconductor manufacturing. Unfortunately, in the semiconductor industry, changes in technology are measured in months, not years. Our challenge was to write a relevant book that would not be outdated by the time it was published. With that in mind, we researched the material and applied ourselves to writing the chapters and creating the artwork. Following the aggressive pace of Moore’s law, the technical material in our book is at most only 18 to 24 months old. This permits us to keep abreast of the changing technology nodes swirling through the semiconductor industry./PPThis text is written for students in two-year and four-year technology programs at community colleges and universities. The text will also be a practical reference as well as a standard text in corporate and technical training classes. Students are expected to have an understanding of high school chemistry, physics, and math. Chapters are organiz@Uw®záH ¾Û€